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  • 型号: BCR 533 E6327
  • 制造商: Infineon
  • 库位|库存: xxxx|xxxx
  • 要求:
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BCR 533 E6327产品简介:

ICGOO电子元器件商城为您提供BCR 533 E6327由Infineon设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供BCR 533 E6327价格参考以及InfineonBCR 533 E6327封装/规格参数等产品信息。 你可以下载BCR 533 E6327参考资料、Datasheet数据手册功能说明书, 资料中有BCR 533 E6327详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

TRANS PREBIAS NPN 300MW SOT23-3开关晶体管 - 偏压电阻器 NPN Silicon Digital TRANSISTOR

产品分类

晶体管(BJT) - 单路﹐预偏压式分离式半导体

品牌

Infineon Technologies

产品手册

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,开关晶体管 - 偏压电阻器,Infineon Technologies BCR 533 E6327-

数据手册

https://www.infineon.com/dgdl/bcr533.pdf?folderId=db3a30431428a3730114407566730303&fileId=db3a30431428a3730114407da25d030a

产品型号

BCR 533 E6327

不同 Ib、Ic时的 Vce饱和值(最大值)

300mV @ 2.5mA,50mA

不同 Ic、Vce 时的DC电流增益(hFE)(最小值)

70 @ 50mA,5V

产品种类

开关晶体管 - 偏压电阻器

供应商器件封装

PG-SOT23-3

其它名称

BCR 533 E6327-ND
BCR533E6327
BCR533E6327BTSA1
BCR533E6327HTSA1
BCR533E6327XT
SP000010853

典型电阻器比率

1

典型输入电阻器

10 kOhms

功率-最大值

330mW

包装

带卷 (TR)

商标

Infineon Technologies

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

TO-236-3,SC-59,SOT-23-3

封装/箱体

SOT-23-3

峰值直流集电极电流

500 mA

工具箱

/product-detail/zh/KIT%20AF%20TRANS.%206/KITAFTRANS.6IN-ND/2025022

工厂包装数量

3000

晶体管极性

NPN

晶体管类型

NPN - 预偏压

最大工作温度

+ 150 C

最小工作温度

- 65 C

标准包装

3,000

电压-集射极击穿(最大值)

50V

电流-集电极(Ic)(最大值)

500mA

电流-集电极截止(最大值)

100nA(ICBO)

电阻器-发射极基底(R2)(Ω)

10k

电阻器-基底(R1)(Ω)

10k

直流集电极/BaseGainhfeMin

70

系列

BCR533

配置

Single

集电极—发射极最大电压VCEO

50 V

零件号别名

BCR533E6327HTSA1 SP000010853

频率-跃迁

100MHz

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PDF Datasheet 数据手册内容提取

BCR533 NPN Silicon Digital Transistor • Built in bias resistor (R = 10 kΩ, R = 10 kΩ) 1 2 3 2 • Pb-free (RoHS compliant) package 1 • Qualified according AEC Q101 C 3 R1 R2 1 2 B E EHA07184 Type Marking Pin Configuration Package BCR533 XCs 1=B 2=E 3=C SOT23 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage V 50 V CEO Collector-base voltage V 50 CBO Input forward voltage V 50 i(fwd) Input reverse voltage V 10 i(rev) Collector current I 500 mA C Total power dissipation- P 330 mW tot T ≤ 79 °C S Junction temperature T 150 °C j Storage temperature T -65 ... 150 stg Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) R ≤ 215 K/W thJS 1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation) 1 2011-10-06

BCR533 Electrical Characteristics at T = 25°C, unless otherwise specified A Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage V 50 - - V (BR)CEO I = 100 µA, I = 0 C B Collector-base breakdown voltage V 50 - - (BR)CBO I = 10 µA, I = 0 C E Collector-base cutoff current I - - 100 nA CBO V = 50 V, I = 0 CB E Emitter-base cutoff current I - - 0.75 mA EBO V = 10 V, I = 0 EB C DC current gain- h 70 - - - FE I = 50 mA, V = 5 V C CE Collector-emitter saturation voltage1) V - - 0.3 V CEsat I = 50 mA, I = 2.5 mA C B Input off voltage V 0.6 - 1.5 i(off) I = 100 µA, V = 5 V C CE Input on voltage V 1 - 2.5 i(on) I = 10 mA, V = 0.3 V C CE Input resistor R 7 10 13 kΩ 1 Resistor ratio R /R 0.9 1 1.1 - 1 2 AC Characteristics Transition frequency f - 100 - MHz T I = 50 mA, V = 5 V, f = 100 MHz C CE 1Pulse test: t < 300µs; D < 2% 2 2011-10-06

BCR533 DC current gain h = ƒ(I ) Collector-emitter saturation voltage FE C V = 5 V (common emitter configuration) V = ƒ(I ), h = 20 CE CEsat C FE 10 3 0.5 V -40 °C 0.4 -25 °C 25 °C 0.35 10 2 85 °C E F 125 °C C h I 0.3 0.25 0.2 -40 °C 10 1 -25 °C 0.15 25 °C 85 °C 125 °C 0.1 0.05 10 01 0 -4 10 -3 10 -2 10 -1 A 10 0 01 0 -3 10 -2 10 -1 A 10 0 I V C CEsat Input on Voltage Vi(on) = ƒ(IC) Input off voltage Vi(off) = ƒ(IC) V = 0.3V (common emitter configuration) V = 5V (common emitter configuration) CE CE 10 2 10 1 V -40 °C -25 °C V 25 °C 85 °C 125 °C n) 10 1 -40 °C Vi(o -2255 ° °CC Vi(off) 85 °C 125 °C 10 0 10 0 10 -1 10 -1 10 -4 10 -3 10 -2 10 -1 A 10 0 10 -5 10 -4 10 -3 A 10 -2 I I C C 3 2011-10-06

BCR533 Total power dissipation P = ƒ(T ) Permissible Pulse Load R = ƒ(t ) tot S thJS p 10 3 400 K/W mW 300 10 2 S ot hJ Pt 250 Rt 200 10 1 0.5 0.2 150 0.1 0.05 0.02 100 10 0 0.01 0.005 D = 0 50 00 20 40 60 80 100 120 °C 150 10 -11 0 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 T t S p Permissible Pulse Load P /P = ƒ(t ) totmax totDC p 10 4 - C D ot Pt 10 3 /ax D = 0 m 0.005 ot Pt 0.01 0.02 10 2 0.05 0.1 0.2 0.5 10 1 10 0 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 t p 4 2011-10-06

Package SOT23 BCR533 Package Outline N. 1±0.1 MI 2.9±0.1 B 15 0.1 MAX. 0. 0.4-+00..0151) 1 3 2 C 2.4±0.15 10˚ MAX. 0.08...0.10˚ MAX.15 A1.3±0.1 0.95 0...8˚ 1.9 0.25M B C 0.2M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 9 0. 3 1. 0.8 1.2 0.9 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 0.2 2.132.65 8 Pin 1 3.15 1.15 5 2011-10-06

BCR533 Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2011-10-06

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